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PMD4002K
MOSFET driver
Rev. 01 -- 3 November 2006 Product data sheet
1. Product profile
1.1 General description
NPN switching transistor and high-speed switching diode to protect the base-emitter junction in reverse direction in a SOT346 (SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I I I I I I Switching transistor and high-speed switching diode as driver High-speed switching diode to protect the base-emitter junction Application-optimized pinout Internal connections to minimize layout effort Space-saving solution Reduces component count
1.3 Applications
I Power MOSFET driver
1.4 Quick reference data
Table 1. Symbol VCEO IC ICM Diode IF VF
[1]
Quick reference data Parameter collector-emitter voltage collector current peak collector current single pulse; tp 1 ms Conditions open base Min Typ Max 40 0.6 1 Unit V A A
NPN transistor
forward current forward voltage
Pulse test: tp 300 s; 0.02.
IF = -200 mA
[1]
-
-0.2 -1.1
A V
-
NXP Semiconductors
PMD4002K
MOSFET driver
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description base TR1, cathode D1 emitter TR1, anode D1 collector TR1
1 2
D1
Simplified outline
3
Symbol
3
TR1
1
2
006aaa655
3. Ordering information
Table 3. Ordering information Package Name PMD4002K SC-59A Description plastic surface-mounted package; 3 leads Version SOT346 Type number
4. Marking
Table 4. Marking codes Marking code D2 Type number PMD4002K
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
2 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO IC ICM IB IBM Ptot Parameter collector-base voltage collector-emitter voltage collector current peak collector current base current peak base current total power dissipation single pulse; tp 1 ms Tamb 25 C
[1] [2] [3]
Conditions open emitter open base single pulse; tp 1 ms
Min -
Max 40 40 0.6 1 0.2 0.3 250 330 445 -0.2 -0.6
Unit V V A A A A mW mW mW A A
NPN transistor
Diode IF IFRM IFSM forward current repetitive peak forward current non-repetitive peak forward current tp 1 ms; = 0.25 square wave tp 1 s tp 100 s tp 10 ms Device Tj Tamb Tstg
[1] [2] [3]
-
-65 -65
-9 -3 -1.7 150 +150 +150
A A A C C C
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint.
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
3 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
500 Ptot (mW) 400
(2) (1)
006aaa870
300
(3)
200
100
0 -75
-25
25
75
125 175 Tamb (C)
(1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint
Fig 1. Power derating curves
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 500 375 280
Unit K/W K/W K/W
NPN transistor
[1] [2] [3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint.
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
4 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01
006aaa871
0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103 duty cycle = Zth(j-a) (K/W) 102 0.2 0.1 0.05 10 0.02 0.01 0 1 0.75 0.5 0.33
006aa872
1 10-5
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
FR4 PCB, mounting pad for collector 1 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
5 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10-5
006aaa873
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
6 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
7. Characteristics
Table 7. Characteristics Conditions VCB = 40 V; IE = 0 A VCB = 40 V; IE = 0 A; Tj = 150 C VCE = 5 V; IC = 1 mA VCE = 5 V; IC = 200 mA VCE = 5 V; IC = 500 mA VCEsat VBEsat VBE Diode VF Device td tr ton ts tf toff td tr ton ts tf toff
[1]
[1]
Symbol Parameter NPN transistor ICBO collector-base cut-off current DC current gain
Min 100 100 50 [1]
Typ 210 170 100 150 300 0.86 0.95 830 6 21 27 484 120 604 3 1 4 23 41 64
Max 10 10 300 250 500 1 1.1 -1.1 -
Unit nA A
hFE
collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage forward voltage delay time rise time turn-on time storage time fall time turn-off time delay time rise time turn-on time storage time fall time turn-off time
IC = 200 mA; IB = 20 mA IC = 500 mA; IB = 50 mA IC = 200 mA; IB = 20 mA IC = 500 mA; IB = 50 mA VCE = 5 V; IC = 300 mA IF = -200 mA IC = 0.15 A; IB = 5 mA
[1] [1]
mV mV V V mV V ns ns ns ns ns ns ns ns ns ns ns ns
-
Device with optional capacitor C1 IC = 0.15 A; IB = 5 mA; C1 = 1 nF -
Pulse test: tp 300 s; 0.02.
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
7 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
300 hFE
006aaa874
1.2 IC (A) IB (mA) = 30 27 24 21 18
006aaa875
200
(2)
0.8
(3) (4) (5)
(1)
100
0.4
15 12 9 6 3
0 10-1
1
10
102 IC (mA)
103
0 0 2 4 6 8 10 VCE (V)
VCE = 5 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C (4) Tamb = 125 C (5) Tamb = 150 C
Tamb = 25 C
Fig 5. DC current gain as a function of collector current; typical values
1.2 VBE (V) 1.0
006aaa876
Fig 6. Collector current as a function of collector-emitter voltage; typical values
1.2 VBEsat (V) 1.0
006aaa877
(1)
0.8
(2)
0.8
(1)
0.6
(3)
0.6
(2)
(3)
0.4
0.4
0.2 10-1
1
10
102 IC (mA)
103
0.2 10-1
1
10
102 IC (mA)
103
VCE = 5 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
IC/IB = 20 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
Fig 7. Base-emitter voltage as a function of collector current; typical values
Fig 8. Base-emitter saturation voltage as a function of collector current; typical values
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
8 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
1
006aaa878
1
006aaa879
VCEsat (V)
(1) (2) (3)
VCEsat (V)
(1) (2)
10-1
10-1
(3)
10-2 10-1
1
10
102 IC (mA)
103
10-2 10-1
1
10
102 IC (mA)
103
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
Tamb = 25 C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10
Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values
Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values
8. Test information
VCC
RC
oscilloscope
(probe) 450
C1
VO
(probe) 3 k
oscilloscope
R2
VI
R1 D1
TR1
DUT
006aaa869
IC = 0.15 A; IB = 5 mA; R1 = 50 ; R2 = 1 k; RC = 68 ; C1 = 1 nF
Fig 11. Test circuit for switching times
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
9 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
9. Package outline
3.1 2.7 3 0.6 0.2 1.3 1.0
3.0 1.7 2.5 1.3
1
2 0.50 0.35 0.26 0.10 04-11-11
1.9 Dimensions in mm
Fig 12. Package outline SOT346 (SC-59A/TO-236)
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMD4002K
[1]
Package SOT346
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 15.
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
10 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
11. Soldering
3.30 1.00 0.70 (3x) 0.60 (3x) 0.70 (3x) 3 3.15 1.55 0.95 1 2 0.95 3.40
1.20 2.60 2.90 solder lands solder paste solder resist occupied area
sot346
Dimensions in mm
Fig 13. Reflow soldering footprint
4.70 2.80
solder lands solder resist occupied area
Dimensions in mm
3
5.20 4.60 1.20
1
2
sot346
1.20 (2x) 3.40 preferred transport direction during soldering
Fig 14. Wave soldering footprint
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
11 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
12. Mounting
43.4 43.4
10 0.7 10 0.8 40 40 0.7 0.5 0.5
0.8
Dimensions in mm
006aaa674
Dimensions in mm
006aaa675
PCB thickness: FR4 PCB = 1.6 mm ceramic PCB = 0.635 mm
PCB thickness = 1.6 mm
Fig 15. FR4 PCB, standard footprint; ceramic PCB, Al2O3, standard footprint
Fig 16. FR4 PCB, mounting pad for collector 1 cm2
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
12 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
13. Revision history
Table 9. Revision history Release date 20061103 Data sheet status Product data sheet Change notice Supersedes Document ID PMD4002K_1
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
13 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PMD4002K_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 3 November 2006
14 of 15
NXP Semiconductors
PMD4002K
MOSFET driver
16. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 November 2006 Document identifier: PMD4002K_1

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